This paper introduces a novel method for effective transdermal delivery of extracellular vesicles (EVs) using a pain-free, dual-amplified microneedle-cupping patch (MN@EV/SC). The patch utilizes shorter microneedles to minimize pain while deforming the skin’s microstructure to enhance drug delivery efficiency. The study demonstrates that this patch delivers EVs uniformly and deeply into the skin, showing significant potential for anti-aging and therapeutic applications.
Wet Bio-Adhesion Technology Using Flexible Micro-Cylinders Inspired by a Beetle’s Structure
This study introduces a technology that maintains high adhesion even in wet or moist environments by developing perforated micro-cylinders (PMMCs) inspired by the footpads of a diving beetle. Unlike conventional dry-adhesion techniques, this patch uses an oil-loadable...
